DP Semiconductor Laser Machine

Applicable materials and industries a.Metallic and non-metallic materials. Especially applicable to processing products requiring fineness and high precision. b.Applicable to electronic components, ICs, electric appliances, handsets, hardware, tools, parts, precision machinery, lens, clocks, watches, jewelries, auto parts, plastic buttons, building materials, PVC pipelines, and medical instruments. c.Plain metals and their alloys (iron, steel, aluminum, magnesium and zinc), rare metals and their alloys (gold, silver and titanium), metallic oxides, special surface treatment (phosphorized, aluminum anodized and galvanized surfaces), ABS (cases for electric appliances and daily articles), printing ink (transparent buttons and printed matters), and epoxy resin (encapsulation of electronic components, and insulating layers). Technical specification (DP Semiconductor laser machine) Max.laser power 50W 75W Laser wavelength 1064nm beam quality M2,Less than6 Laser repetition frequency ≤30kHz Standard engraving range 100mm×100mm Optional engraving range 50mm×50mm/100mm×100mm Engraving depth ≤0.3mm ≤0.5mm Engraving line speed ≤7000mm/s Min.line width 0.015mn Repeatable accuracy ±0.003mm Overall system power 2.5KW Power requirement 220V/single phase /50Hz/20A Host system dimensions 880mm×950mm×(1040-1350)mm Cooling system dimensions 650mm×450mm×920mm